Method of using low profile additives for crosslinkable resins
US6544453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Jul 24, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Shrinkage of cured resins is reduced by mixing the crosslinkable resin with a low profile additive (LPA). The LPA is in the form of particles which comprise an SCC polymer (or a similar crystalline polymer which melts over a narrow temperature range). The system is cured at a temperature above the melting point of the crystalline polymer (Tp), and the system and the LPA are such that at least part of the LPA remains as a separate phase in the curable resin at temperatures below Tp. It is believed that at least part of the crystalline polymer remains as a separate phase in the resin as it cures. Preferably at least part of the crystalline polymer forms a separate phase in the cured polymer after it has cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.