Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured thereby
US6544814B1 · kind B1 · utility
19Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Jan 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of semiconductor chips are mounted on an insulating substrate with bumps and through use of dielectric resin for mounting purposes. The semiconductor chips are sealed with transfer mold resin through a single operation while remaining on the insulating substrate. Then, the plurality of semiconductor chips are separated together with the insulating substrate and the mounting resin into individual semiconductor devices. The productivity and reliability of packaged semiconductor devices is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.