Silicone composition for forming a release coating
US6545076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2001 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | May 3, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A solvent free silicone composition for forming a cured release coating comprising(A) 100 parts by weight of a diorganopolysiloxane having in each molecule at least two alkenyl groups and a viscosity of 50 to 5,000 mPa·s at 25° C.;(B) 3 to 50 parts by weight of an organohydrogenpolysiloxane mixture comprising constituent (b-1) and constituent (b-2) in a weight ratio of 1:0.01 to 1:1, where (b-1) is a diorganopolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having both molecular terminals capped with silicon-bonded hydrogen atoms and (b-2) is an organohydrogenpolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having at least three pendant silicon-bonded hydrogen atoms in each molecular chain; and(C) a catalytic amount of a platinum-type catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.