Method and apparatus for the laser machining of workpieces

US6545250B2 · kind B2 · utility

Assignee

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Andreas Hartmann · Stadtbergen, DE
• Frank Kretzschmar · Bayreuth, DE
• Annett Klotzbach · Dresden, DE
• Lothar Morgenthal · Dresden, DE
• Dieter Pollack · Dresden, DE
• Thomas Schwarz · Rhede, DE

Key dates

• Filing date: Dec 22, 2000
• Grant date: Apr 8, 2003
• Expiry date: Dec 22, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/082
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a method and an apparatus for the laser machining of workpieces, a laser beam being two-dimensionally positionable with the aid of a laser machining head with respect to a surface of a workpiece and it being intended for the machining of the workpiece to take place with predeterminable contours. According to the object, it is to be possible for the forming of the contours to be realized with high positional accuracy at low cost and with little effort. To achieve this object, the laser beam is correspondingly guided by means of a laser machining head, in which at least one two-dimensionally pivotable scanner mirror is accommodated. The scanner mirror or two scanner mirrors is/are connected to an electronic evaluation and control unit. Before the actual machining, a set-actual value comparison is carried out with respect to the position of the workpiece with at least one predetermined contour with respect to the laser machining head. For this purpose, a light beam of a light source is focused and directed via one or else two scanner mirror(s) onto the surface of the workpiece and deflected along at least one axis by pivoting at least one of the scanner mirror…