Printing form and method of modifying the wetting characteristics of the printing form
US6546868B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Mar 29, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0042
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The printing form, such as a printing plate or the surface of a printing cylinder, has a semiconducting surface with defined hydrophobic and hydrophilic areas corresponding to a print image to be printed with the printing form. The wetting characteristics of the printing form can be altered. To this end, the surface of the printing form is first placed into an essentially uniform chemical state with a first wetting behavior. Parts of all of the areas of the semiconductor surface are then put into a second chemical state which has a second wetting property that is different from the first.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.