Profile printing method with additive technology
US6546872B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24901
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of printing and the resulting printed product is disclosed which provides a three dimensional raised look and feel without requiring expensive embossing rollers. A surface tension lowering additive is added to ink or clear resin or varnish, and the ink is printed onto a substrate in a pattern of substantially parallel lines, leaving spaces of substrate exposed between the lines of ink or clear resin or varnish. The clear resin or varnish may also be printed on a clear film and ink is then printed on the resin or varnish. The film can then be laminated to a metallized film, foil or other reflective surface. A resin coating is applied over the printed pattern. The resin collects in the areas of exposed substrate due to the differential surface tension. The result is a pattern of raised resin profile ridges oriented along the pattern of ink lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.