Method for supplying slurry to a semiconductor processing machine
US6547646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Mar 12, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, is disclosed. The method includes providing a supply of slurry and delivering slurry to the semiconductor processing machine. The supply typically provides slurry from a location remote from the semiconductor processing machine to a location proximate the semiconductor processing machine, where the slurry at the location proximate the semiconductor processing machine is unpressurized. A delivery subsystem typically agitates slurry in the basin by flowing the slurry through the basin, thereby inhibiting the settling of suspended particles in the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.