Commercial plating of nanolaminates
US6547944B2 · kind B2 · utility
38Cited by
3References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Jan 20, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.