Processing a printed wiring board by single bath electrodeposition
US6547946B2 · kind B2 · utility
4Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.