Process for manufacturing packaging film
US6548108B1 · kind B1 · utility
5Cited by
9References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1999 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Dec 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31667
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for manufacturing a packaging film that is transparent to UV light and has a barrier action against water vapor and gases. The packaging film includes a substrate film of a polyolefin or polyamide with a ceramic coating layer of SiOx, where x is a number from 1.5 to 1.8. The thickness of the ceramic coating layer is 10 nm to 2 &mgr;m. The ceramic coating layer of SiOx is deposited onto the polyolefin or polyamide substrate film using a vacuum thin film deposition process by depositing silicon oxide (SiO2) and elementary silicon (Si) simultaneously in vacuum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.