Method of and apparatus for developing exposed photoresist to prevent impurity from being attached to wafer surface
US6548228B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Jan 29, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
After a silicon wafer is held horizontally such that a surface thereof coated with a photoresist faces upwardly, the surface of the silicon wafer is supplied with a cleaning liquid to form a puddle thereof before a developing liquid is supplied. After the puddle of the cleaning liquid is formed, the silicon wafer starts to be rotated and the developing liquid starts to be supplied to the surface of the silicon wafer. The developing liquid is supplied to the surface of the silicon wafer with the puddle of the cleaning liquid being formed thereon. Alternatively, developing liquid is supplied to the surface of the silicon wafer which is being supplied with cleaning liquid while the silicon wafer is being rotated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.