Patent · US Expired

Laminating adhesives hardenable by radiation

US6548566B1 · kind B1 · utility

7Cited by

3References

28Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Achim Huebener · Seevetal, DE
Guenter Henke · Neuss, DE
Michael W. Drobnik · Downers Grove, US

Key dates

Filing date	Aug 15, 2000
Grant date	Apr 15, 2003
Priority date	—
Expiry date	Aug 15, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A method of forming a film laminate uses an adhesive containing at least three components A, B and C.The method includes providing a radiation curable adhesive that contains a) a compound bearing at least one epoxy group, b) a compound with at least three OH groups and a molecular weight below 400 and c) a photoinitiator which initiates a polymerization of components a) and b) after exposure to light with a wavelength of 100 to 600 nm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.