Wire bond pad
US6548887B2 · kind B2 · utility
1Cited by
18References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2002 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond pad in an electrical circuit device package and method therefor including forming an opening in a conductor of a first electrically conductive material, forming a conducting member of a second electrically conductive material, transferring the conducting member into the opening of the conductor, electrically contacting the conducting member with the conductor, and embedding conductor with the conducting member in the opening thereof in an insulating electrical circuit device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.