Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages
US6548893B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Jul 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for hermetically sealing, EMI shielding integrated circuits for high-speed electronic devices using a combination of microstrip to buried stripline interface for signal transmission from the integrated circuit. The packaging provided comprises a first plurality of microstrips interconnecting the integrated circuit to a plurality of buried striplines exposed on a surface of the main substrate. A ceramic interposer placed over the main substrate “buries” a portion of the exposed striplines on the main substrate to thereby insulate these signal paths from a hermetically sealing, and EMI shielding metal lid placed over the integrated circuit. The metal lid and the seal ring brazed over the ceramic interposer thus provide both a hermetic seal and an electric radiation block. A reduction in dispersion due to the buried striplines is also achieved, as well as improving jitter performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.