Patent · US Expired

Method of interconnecting with a system board

US6549024B2 · kind B2 · utility

0Cited by
12References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 19, 2002
Grant dateApr 15, 2003
Priority date
Expiry dateJul 19, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/045
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.