Apparatus and method for temperature control of IC device during test
US6549026B1 · kind B1 · utility
89Cited by
15References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Jan 4, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2862
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for controlling the temperature, during testing, of IC devices formed on a wafer includes a chuck for locating the devices during testing and multiple temperature control devices arranged on the chuck to correspond with the arrangement of the devices being tested on the wafer. The chuck itself can be cooled or heated, such as by the flow of a temperature-controlled fluid, and a temperature control device such as a heating element can be associated with each IC device being tested. Alternatively, a separate heat sink can be associated with each temperature control device and its corresponding IC device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.