CPU cooling device using thermo-siphon
US6549408B2 · kind B2 · utility
40Cited by
12References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A hollow evaporator is disposed in contact with the upper surface of the CPU. Heat from the CPU is absorbed by the evaporation of the refrigerant. The vaporized refrigerant ascends through the vapor flow channel by convection, flows into a condenser located above the evaporator, and radiates heat to be liquefied. The liquefied refrigerant flows down by its own weight through the liquid flow channel and returns to the evaporator. This circulation is repeated in this manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.