Power converter assembly
US6549409B1 · kind B1 · utility
109Cited by
19References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Oct 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1° C.−in2/Watt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.