Flexible heat sinks and method of attaching flexible heat sinks
US6549411B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This invention teaches that the heat sink and/or the object from which heat is to be removed may have significant flexibility. Indeed, it may be advantageous for one or both to have significant flexibility in that it allows good conformity for good thermal contact even if one or the other is uneven. The heat sink is attached to the object from which heat is to be removed with a good adhesive or solder under vacuum or with external pressure. The flexible heat sink may be much smaller and lighter in weight than a conventional heat sink. It may use less material and have less stringent machining requirements, so it may be much more economical to fabricate and use. Because a vacuum is used to pull the interface together at all points, there are fewer gaps or voids and the adhesive layer may be much thinner, for improved heat conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.