Method for adhering reinforcing patches during superplastic forming
US6550124B2 · kind B2 · utility
13Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is disclosed for temporarily bonding reinforcing sheet metal pieces or other metal pieces to a sheet metal blank for forming at an elevated temperature such as is employed in superplastic forming of suitable aluminum, magnesium, stainless steel or titanium alloys. The pieces are bonded to the blank in locations in which the piece will acquire a desired shape from co-formation with the blank. Suitable water suspendible sodium silicate compositions, such as water glass bond the piece to the blank during high temperature forming and permit removal after forming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.