Spray cooling system for a device
US6550263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.