Isolation technique for pressure sensing structure
US6550337B1 · kind B1 · utility
40Cited by
21References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.