Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
US6550664B2 · kind B2 · utility
94Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Apr 25, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths are incorporated in the base portion. Solder joints attach the die to the base portion. The solder joints electrically connect pads on the die to the signal paths in the base portion. The solder joints do not include, and are used instead of, wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.