Image sensor mounting system
US6550679B2 · kind B2 · utility
201Cited by
29References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jun 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/54
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the invention, a multilayered image sensor is back mounted to a plate, and the plate in turn, is installed in a holding pocket of a device. In that the scheme takes advantage of a high controllability of a mounting plate's thickness, the mounting scheme provides a tight control of holding forces with which an image sensor is secured in an imaging device. In that the scheme provides for back mounting of image sensor on a planar surface, the mounting system provides tight control of an imaging assembly's pixel plane to fixed point in space distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.