Thermal cooled vacuum form
US6550742B1 · kind B1 · utility
0Cited by
20References
15Claims
0Family size
Inventor
Key dates
| Filing date | May 27, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | May 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2905/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for preparing a mold form includes forming a mold blank having a surface corresponding to the surface of the article desired and enclosing the mold blank in an open ended enclosure. A thin layer of polymer resin, preferably polyurea is sprayed on the surface of the mold blank and allowed to cure. Heat transfer tubing is inserted over the resin layer. A mixture of metallic pellets and epoxy are inserted over the heat transfer tubing and then another layer of resin is sprayed over the mixture. After the resin has cured, the mold blank is removed to expose the mold form having an outer surface of polyurea.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.