Semiconductor chip for an ink jet printhead and method for making same
US6550893B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jan 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.