Sinter bonding using a bonding agent
US6551551B1 · kind B1 · utility
36Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for joining powder metallurgy components, in particular, those made by metal injection molding is provided. The method includes providing a first and a second powder metallurgy compact each having a bonding surface and a bonding agent including a binder and fine particles. The bonding agent is placed between the bonding surfaces of the first and second powder metallurgy compacts. The first and second powder metallurgy compacts are then consolidated during a sintering cycle in which the first and second powder metallurgy compacts are joined by at least solid state diffusion of the fine particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.