Dip formation of flip-chip solder bumps
US6551650B1 · kind B1 · utility
5Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Feb 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52). The composite substrate (20) is then dipped or otherwise immersed into a reservoir of liquid solder (106). Next, the composite substrate (20) is redrawn (116), or otherwise removed, from the liquid solder to form solder bumps (113) on the at least one metal wetting pad (52).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.