Liquid developing method of printed wiring board
US6551753B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Apr 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.