Method for manufacture of electronic parts
US6551763B1 · kind B1 · utility
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10References
10Claims
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Key dates
| Filing date | Jun 2, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jun 2, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by pattemwise delivery of heat, comprises a polymer and optionally an infrared absorbing compound. However in contrast to conventional compositions no compound is present which alters the solubility of the polymer in an aqueous developer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.