Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US6551860B2 · kind B2 · utility
27Cited by
16References
15Claims
0Family size
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Key dates
| Filing date | Jan 22, 2002 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.