Printed board assembly and method of its manufacture
US6552265B1 · kind B1 · utility
5Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1999 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Oct 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.