Board integrated resilient contact elements array and method of fabrication
US6552276B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
According to some embodiments of the present invention, a connectable electronic component-carrying board is provided. The connectable electronic board comprises at least one resilient conductive element integrally molded onto at least part of a contact of the connectable board. The resilient conductive element is able to provide an electrical pathway between the contact it is molded to and a corresponding contact on another electronic component-carrying board. A method of fabricating the connectable electronic component-carrying board is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.