Optical transmitting and receiving device and the manufacturing method
US6552366B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1998 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Jul 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An insulation film (silicon dioxide film) is laminated on a platform substrate of Si, etc., and a transmitting unit wiring pattern and a receiving unit wiring pattern are provided on the insulation film. Although a base intruded in a convex shape is provided at the bottom of a light emitting device (LED) of the platform substrate, this base is not provided at the bottom of a light receiving device, and the insulation film under the light receiving device becomes thick. A groove is formed in a waveguide, and a WDM filter is mounted. A diamond or SiC layer can also be provided beneath the insulation film to improve the insulation resistance, and a conduction layer is provided beneath the diamond or SiC layer. Electrical crosstalk is suppressed by grounding the conduction layer. Optical crosstalk is improved by locating the LED at the entrance/exit of the WDM filter and the light receiving device on the opposite side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.