Vehicular modular design multiple application rectifier assembly having outer lead integument
US6552908B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Feb 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes such that plates are selectively negative or positive depending on the plurality of diodes mounted within the plate. A lead integument formed from an insulator material is mounted on a heat sink plate opposing the other heat sink plate and has embedded conductors and connectors that interconnect diode electrodes and other rectifier components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.