Device for thermally, stably supporting a miniaturized component
US6554244B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S248/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention related to a device for supporting a miniaturized, especially electronic or optical component, including a first and a second part, the second part is affixed to the first part on one side at a fixing point, in a cantilevered manner, and supports the component. The projection of the support area of the component onto the first part lies between the fixing point and a predetermined point of reference on the first part. The position of the support area of the component on the second part is chosen in relation to the fixing point between the first and second part and the respective material for the first and second parts is chosen with a specific temperature-dependent expansion coefficient &agr;1 and &agr;2, in such a way that the influence of the temperature-dependent expansion of the first and second part on the position of the support area of the component is at least partially offset in relation to the point of reference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.