Interconnected printhead die and carrier substrate system
US6554399B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jun 24, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1631
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An interconnected printhead die and carrier substrate system for a printhead in hard-copy-producing devices used to print on print media includes a printhead die and a carrier substrate. The die and the substrate are coupled and each has an operative face separated from an inner face, and includes integrated circuits formed therein. At least three spacers are positioned between the die and substrate to define a space that is filled with an adhesive/under-fill layer. An electrical-connection region is located adjacent the inner faces of the die and substrate, and is effective to accommodate bilateral communication between integrated circuits formed on the die and the substrate. The die and the substrate may also have a stepped shape, and a cavity is formed by the stepped die and stepped substrate, with the electrical-connection region being located in the cavity. The electrical-connection region is also encapsulated with an encapsulant that may fill the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.