Quality control plasma monitor for laser shock processing
US6554921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jul 9, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0426
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for quality control of laser shock processing. The method includes measuring emissions and characteristics of a workpiece when subjected to a pulse of coherent energy from a laser. These empirically measured emissions and characteristics of the workpiece are correlated to theoretical shock pressure, residual stress profile, or fatigue life of the workpiece. The apparatus may include a radiometer or acoustic detection device for measuring these characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.