Pressure-sensitive conductive ink composition
US6555024B2 · kind B2 · utility
26Cited by
5References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Dec 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.