Pre-plate treating system
US6555170B2 · kind B2 · utility
6Cited by
19References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 8, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Feb 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/22
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.