Flip-chip assembly of semiconductor devices using adhesives
US6555414B1 · kind B1 · utility
29Cited by
10References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Feb 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a flip-chip-on-board (FCOB) assembly technology applicable for mounting large chips with high I/O count or small pitch, mounted on low-cost or low-grade substrates. The assembly technology uses both an isotropically conductive adhesive (ICA) and a non-conductive material (NCA) in the same assembly cycle. The thermocompression step establishes at the same time the electrical and mechanical interconnections and the curing of the adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.