Device and method for core buildup using a separator
US6555444B1 · kind B1 · utility
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1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 16, 2002 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jan 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device and method to manufacture two substrates simultaneously using a separator. The separator is sandwiched between two cores and adhesive is used to affix to the first core to the second core. Layers are affixed to the first core and the second core simultaneously. The cores are then separated and the separator removed to form two substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.