Method for laser scribing of wafers
US6555447B2 · kind B2 · utility
40Cited by
12References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0201
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction on the substrate by scanning the laser beam across the surface of the substrate to evaporate portions of the coating layer; and forming a second set of scribe lines in a second direction on the surface of the substrate substantially orthogonal to the first set of scribe lines to evaporate portions of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.