Photothermosetting composition comprising acrylated epoxy resin
US6555592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | May 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.