Semiconductor device and producing method thereof
US6555925B1 · kind B1 · utility
15Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2000 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Mar 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a method of producing a semiconductor device in which at least one alignment mark to be used in an exposure process of a lithographic process is formed of a wiring material which is copper or includes copper as a main component, and the alignment mark is formed entirely in an area outside an area where dicing is to be executed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.