Surface wave device connected to a base with a conductive adhesive
US6556105B1 · kind B1 · utility
3Cited by
13References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Aug 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.