Method for assembling a tiled, flat-panel microdisplay array having reflective microdisplay tiles and attaching thermally-conductive substrate
US6556261B1 · kind B1 · utility
74Cited by
16References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2000 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jun 21, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136277
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention describes fabrication techniques for producing microdisplays suitable for combining into tiled, flat-panel displays having visually imperceptible seams. Assembly techniques to overcome flatness requirements imposed by tiled, flat-panel display assemblies are also described. Edge treatment techniques for individual microdisplays while still part of the silicon die or wafer are also described. The use of these inventive techniques allows the assembly microdisplays into tiled, flat-panel that are appear visually seamless and optically uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.