Hybrid fuzzy closed-loop sub-micron critical dimension control in wafer manufacturing
US6556876B1 · kind B1 · utility
6Cited by
8References
2Claims
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Key dates
| Filing date | Oct 12, 2000 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jun 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Variation in results of a semiconductor fabrication process is minimized by adjusting process parameters utilizing a fuzzy-controlled learning feedback system. The fuzzy-controlled learning system receives as inputs the results of the fabrication process and then converts these results into a fuzzy set defined by a membership function. An inference engine applies a fuzzy rule base to map an output fuzzy set from the input fuzzy set. The fuzzy output set is then converted to crisp outputs which automatically adjusts parameters of the fabrication process in order to minimize variation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.