Component placement apparatus
US6557247B1 · kind B1 · utility
2Cited by
5References
40Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2000 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component placement apparatus including a head mount having at least one pick and place head; component carrier; and component receiver, the at least one pick and place head being arranged to pick up a component from the component carrier and place it on the component receiver, wherein the head mount is movable to move the at least one pick and place head in a single plane; the component carrier is movable in a plane transverse to the at least one pick and place head at a pick up position; and the component receiver is movable in a plane transverse to the at least one pick and place head at a placement position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.