Jet coating method for semiconductor processing
US6558877B1 · kind B1 · utility
2Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Jul 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2938
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system and method is disclosed for coating a conventional wafer or a spherical shaped semiconductor substrate with liquid material such as photoresist by utilizing a “drop on demand” piezo driven dispense nozzle, a bubble-jet dispense nozzle, or a continuous piezo jet with charging electrodes. The proposed system and method will greatly reduce, and in some cases virtually eliminate, the waste of photoresist in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.